| Module | Rino 3 | Rino 4 |
|---|---|---|
| Release | 2018 | tbd |
| Sensor name | SEES 1 | SEES 2b |
| Resolution | 320 × 262 | 800 × 600 640 × 480 (VGA ROI option) |
| Dynamic range | >100 dB | >100 dB |
| Module dimensions | (35 × 35 × 28) mm | (35 × 35 × 30) mm |
| Time resolution | up to 10 kHz (configurable) | up to 10 kHz (configurable) |
| Latency | <1 ms for >1 lux chip illumination | <1 ms for >1 lux chip illumination |
| Sensor power consumption | 70 mW (typical usage) | 250 mW (typical usage) |
| Sensor output bandwidth | >50 Meps | >80 Meps |
| Optical format | 1/3" | 1/2.3" |
| Pixel pitch | 13 μm | 7.2 μm |
| Die size | (5.3 × 5.3) mm | (8.9 × 8.9) mm |
| Fill factor | 22% | ~100% |
| Lens types | M12 | M12 / CS-Mount |
| Grayscale readout | 30 Hz / 10 bit / ~50 dB / global shutter | 30 Hz / 10 bit / ~50 dB / global shutter |
| IMU | 9 DoF / 1 kHz | 9 DoF / 1 kHz |
| Module interface | (micro) USB 2.0 (~20 Meps bandwidth) | MIPI CSI-2 / USB 3.0 (~80 Meps bandwidth) |
| Technology | FSI 180 nm | BSI stacked |